According to Stratistics MRC, the Global Underfill Dispenser Market is accounted for $65.11 billion in 2021 and is expected to reach $134.32 billion by 2028 growing at a CAGR of 10.9% during the forecast period.
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Underfill material is used in semiconductor wrapping to offer strength, improve the overall consistency and thermo-mechanical recital, and augment the impact resistance. It is used to fill space beneath a die and adhere to its carrier. Underfill creates a strong mechanical link between the chip and the PCB connector, preventing mechanical stress on the soldered parts. It also aids in the transmission of heat.
Some of the key players profiled in the Underfill Dispenser Market include Zymet Inc., MKS Instruments, Inc., Sulzer Ltd., Nordson Corporation, Shenzhen STIHOM Machine Electronics Co., Ltd, Master Bond Inc., Illinois Tool Works, Henkel AG & Co. KGaA , Essemtec AG and Zmation Inc.
Product Types Covered:
• No Flow Underfill
• Molded Underfill
• Capillary Flow Underfill
Applications Covered:
• Consumer Electronics
• Semiconductor Packaging
End Users Covered:
• Flip-Chips
• Chip Scale Packaging
• Ball Grid Array
Regions Covered:
• North America
o US
o Canada
o Mexico
• Europe
o Germany
o UK
o Italy
o France
o Spain
o Rest of Europe
• Asia Pacific
o Japan
o China
o India
o Australia
o New Zealand
o South Korea
o Rest of Asia Pacific
• South America
o Argentina
o Brazil
o Chile
o Rest of South America
• Middle East & Africa
o Saudi Arabia
o UAE
o Qatar
o South Africa
o Rest of Middle East & Africa
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