According to Stratistics MRC, the Global Wafer Level Packaging Market is accounted for $9.58 billion in 2024 and is expected to reach $29.78 billion by 2030 growing at a CAGR of 20.8% during the forecast period. \
Wafer Level Packaging (WLP) is a state-of-the-art semiconductor packaging method that encapsulates chips at the wafer level prior to their separation into separate pieces. By doing away with the need for conventional packaging procedures, which are typically performed after the wafer is cut, this technique offers benefits like smaller size, improved performance, and cheaper production costs. Moreover, WLP is particularly well suited for small, high-performing devices like wearables, smartphones, and automotive electronics because it positions components close together, allowing for high-density interconnections, better thermal management, and faster signal transmission.
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The Wafer Level Packaging (WLP) market is anticipated to grow at the highest CAGR in the North American region. The demand for sophisticated semiconductor packaging is rising in sectors like consumer electronics, healthcare, automotive, and telecommunications, especially as 5G, driverless cars, and the Internet of Things (IoT) become more prevalent. Numerous top semiconductor companies and research institutes that are at the forefront of packaging technology innovation are based in North America. Moreover, the need for sophisticated WLP solutions is further accelerated by the expanding use of data centers, artificial intelligence (AI), and high-performance computing.
Some of the key players in Wafer Level Packaging market include Amkor Technology, Inc., Fujitsu Limited, Nordson Corporation, Toshiba Corporation, Lam Research Corporation, Qualcomm Technologies, Inc., Siliconware Precision Industries Co., Ltd., Deca Technologies, Inc, Nemotek Technology Inc., Infineon Technologies AG, Taiwan Semiconductor Manufacturing Company Limited, KLA Corporation, Applied Materials, Inc., ChipMOS Technologies Inc. and Tokyo Electron Ltd.
Key Developments:
In September 2024, Fujitsu Limited and Stellar Science Foundation, a General Incorporated Association have entered into a partnership focused on discovering and supporting the next generation of scientific researchers and fostering the creation of cutting-edge research topics.
In May 2024, Nordson Corporation announced that it has entered into a definitive agreement to acquire Atrion Corporation, a leader in proprietary medical infusion fluid delivery and niche cardiovascular solutions, for $460.00 per share in cash. This reflects a valuation of 15X Atrion’s 2024 full-year estimated EBITDA, inclusive of synergies Nordson expects to generate in the first two years of its ownership.
In May 2024, Amkor Technology, Inc. announced that it has entered into a strategic long-term agreement with IBM for semiconductor assembly and test services. Under the long-term supply agreement, Amkor will receive the substantial majority of IBM’s subcontract wire bond and flip chip assembly and final test.
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