Global Bonding Sheet Market Report, Market Size, Share, Trends, Analysis and Forecast to 2028

Stratistics MRC’s Global Bonding Sheet Market value is expected to reach $792.47 million growing at a CAGR of 9.4% during 2023-2030.

A bonding sheet is a sheet or film used for surface covering or bonding that has a cement coating on one side. To prevent an early grip, it has a separate paper discharge layer. Despite occasionally is available in finished variations, it is often reflexive and smooth. It goes under a variety of names, including sheet glue, unadulterated cement, and just glue. A Bonding sheet is typically employed in multi-facet coverings to join flexible interior layers or stiff cap layers. It is frequently used for creating intensity sinks, rigid flex PCBs, bond stiffeners, and other components to attach flexible circuits to unbending flex sheets. In addition, it is used for elaborate overlays.

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Asia Pacific is projected to have the highest CAGR over the forecast period. Consumer’s rising disposable incomes, bettering lifestyles, and the growing use of mobile devices all contribute to the market’s expansion. The expansion of the market in the region is supported by the economic development and industrialization of China, Japan, Australia, and India, the rising sales of passenger cars, and the thriving construction industry. To take advantage of the cheap labor and raw resources in emerging nations, multinational corporations are establishing manufacturing facilities there. The huge applications of bonding sheets in electronics and automotive sectors is driving the market growth in the region.

Some of the key players profiled in the Bonding Sheet Market include DuPont, Namics Corporation, Fujikura Ltd, Nikkan Industries Co.,Ltd, Microcosm Technology Co., Ltd, Dexerials Corporation, Nitto Denko Corporation, Arisawa Manufacturing Corporation, Hanwha Solutions Advanced Materials Division, Shin-Etsu Polymer Co. Ltd., Showa Denko Materials Co., Taiflex Scientific Co. Ltd, Qinglong Adhesives, Nippon Mektron Ltd and Toray Industries, Inc.

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Key Developments:

In May 2023, DuPont announced that it will introduce its latest Tedlar® frontsheet materials at the 2023 SNEC International Photovoltaic Power Generation and Smart Energy Exhibition. DuPont will be located at Booth W4-555 at Shanghai New International Expo Center.

In February 2023, Nippon Paper Industries Co., Ltd. announced the establishment of a manufacturing and sales subsidiary in Hungary for CMC (carboxymethyl cellulose, product name: SUNROSE MAC®), which is one of the materials used for lithium-ion battery (LiB) anodes in electric vehicles (EV), to join its rapidly growing supply chain system in Europe.

In February 2022, Shin-Etsu Chemical, the parent organization of Shin-Etsu Polymer Co., Ltd. is investing approximately USD 680 million in manufacturing facilities in Japan. The company has adopted the investments & expansions strategy to increase the production capacity of silicon-based products including silicon resins, fluids, and other related products. The facility is expected to increase production capacities and become operational by 2025.


What our report offers:
– Market share assessments for the regional and country-level segments

– Strategic recommendations for the new entrants

– Covers Market data for the years 2021, 2022, 2023, 2026, and 2030

– Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)

– Strategic recommendations in key business segments based on the market estimations

– Competitive landscaping mapping the key common trends

– Company profiling with detailed strategies, financials, and recent developments

– Supply chain trends mapping the latest technological advancements

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