Stratistics MRC’s Global Dynamic Random Access Memory Market value is expected to reach $337.6 billion growing at a CAGR of 15.5% during 2023-2030.
Each bit of data is stored in a memory cell by a semiconductor memory called dynamic random access memory (DRAM). In capacitors located inside an integrated circuit, data is stored as a string of electrical charges. It is a typical kind of random access memory (RAM) that is used in workstations, servers, mobile devices, smartphones, and tablets. Memory can be refreshed and removed while a program is running thanks to DRAM’s straightforward design, which only needs one transistor.
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The Asia Pacific region witnessed highest CAGR in the Dynamic Random Access Memory (DRAM) market, driving its growth through a combination of manufacturing prowess, technological advancement, and robust demand. Home to major semiconductor manufacturers, Asia Pacific plays a pivotal role in the production and supply of DRAM components, capitalizing on its skilled workforce and cost-effective production capabilities. Rapid urbanization and the proliferation of digital technologies across sectors have fuelled substantial demand for DRAM products in consumer electronics, automotive, and data centres. As a result, the region’s economic dynamism and innovation continue to shape the global DRAM market landscape.
Some of the key players in Dynamic Random Access Memorymarket include Winbond Electronics Corporation, Integrated Silicon Solution Inc., ATP Electronics Inc., Nanya Technology Corporation, Powerchip Technology Corporation, Etron Technology Inc., Transcend Information Inc., Kingston Technology Corporation, SK Hynix Inc., Micron Technology Inc. and Samsung Electronics Co. Ltd.
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In September2022, SK Hynix announced that its latest “10anm” DRAM modules are nearly ready for inclusion in next-gen smartphones. It has the fastest transfer rate known to the LPDDR4 standard.
In October2022, Micron Technology developed 176-layer NAND memory, which it incorporates into products such as DRAM and PCIe 4.0 SSDs. It announced that it is also ready to ship new UFS 3.1 storage modules with this property.
In February 2022, Micron Technology announced the launch of uMCP5, the first universal flash storage (UFS) multichip package with low-power DDR5 (LPDDR5) DRAM. Micron’s uMCP5 combines high-performance, high-density, and low-power memory and storage in one compact package, equipping smartphones to handle data-intensive 5G workloads with dramatically increased speed and power efficiency.
What our report offers:
– Market share assessments for the regional and country-level segments
– Strategic recommendations for the new entrants
– Covers Market data for the years 2021, 2022, 2023, 2026, and 2030
– Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
– Strategic recommendations in key business segments based on the market estimations
– Competitive landscaping mapping the key common trends
– Company profiling with detailed strategies, financials, and recent developments
– Supply chain trends mapping the latest technological advancements
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