According to Stratistics MRC, the Global Semiconductor Manufacturing Equipment Market is accounted for $56.12 billion in 2019 and is expected to reach $131.20 billion by 2027 growing at a CAGR of 11.2% during the forecast period. Some of the key factors propelling the market growth include increasing investments in R&D facilities, growing demand for electric and hybrid vehicles, trend of miniaturization and technology migration, and high demand for chips to provide computation power and connectivity for AI applications. However, high purchase and maintenance costs are likely to restraining the market growth.
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Based on the Geography, Asia Pacific is projected to have considerable market growth during the forecast period, owing to favorable economic conditions and cheap labor costs in APAC. The development of semiconductor devices in Asian economies such as China, Japan, South Korea, and Taiwan drives the semiconductor manufacturing equipment market in the region. APAC is the hub for the consumer electronics market, which is served by several fabrication plants present in the APAC region. China, Japan, South Korea, and Taiwan own the maximum number of fabrication plants worldwide.
Some of the key players in Semiconductor Manufacturing Equipment Market include Advantest Corporation, Hitachi High-Technologies Corporation., Plasma-Therm., Tokyo Electron Limited, LAM Research Corporation, Rudolph Technologies, Inc, Vistec Electron Beam GmbH, Screen Holdings Co., Ltd., ASML Holdings N.V., Applied Materials Inc., KLA-Tencor Corporation., Teradyne Inc., Adams Lithographing, Canon Inc., Energetiq Technology, Inc., Nikon Corporation, Gigaphoton Inc., NuFlare Technology Inc., and Toshiba Corporation.
Back-end Equipments Covered:
• Assembly & Packaging Equipment
• Back-End Processes
• Wafer Manufacturing Equipment
• Test Equipment
Front-end Equipments Covered:
• Deposition
• Cleaning Process
• Lithography
• Wafer Surface Conditioning Equipment
• Silicon Wafer Equipment
• Wafer Processing Equipment
• Polishing & Grinding
Products Covered:
• Discrete
• Analog
• Memory
• Logic
• Micro Processing Unit (MPU)
• Micro Electromechanical Systems (MEMS)
Fab Facility Equipments Covered:
• Chemical Control
• Gas Control
• Factory Automation
Supply Chain Participants Covered:
• Outsourced Semiconductor Assembly and Test (OSAT) Companies
• Integrated Device Manufacturer (IDM) Firms
Dimensions Covered:
• 3D
• 2.5D
• 2D
End Users Covered:
• Semiconductor Electronics Manufacturing
• Semiconductor Fabrication Plant/Foundry
• Test Home
Regions Covered:
• North America
o US
o Canada
o Mexico
• Europe
o Germany
o France
o Italy
o UK
o Spain
o Rest of Europe
• Asia Pacific
o Japan
o China
o India
o Australia
o New Zealand
o Rest of Asia Pacific
• South America
o Argentina
o Brazil
o Chile
o Rest of South America
• Middle East & Africa
o Saudi Arabia
o UAE
o Qatar
o South Africa
o Rest of Middle East & Africa
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