According to Stratistics MRC, the Global Embedded Die Packaging Technology Market is accounted for $75.81 billion in 2022 and is expected to reach $230.94 billion by 2028 growing at a CAGR of 20.4% during the forecast period.
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Embedded die packaging technique is a native 3D-compatible packaging method that reduces system in package (SiP) size by 70%. Miniaturization, improves electrical and thermal performance, heterogeneous integration, cost reduction potential, and successful OEM logistics are just a few of the many advantages of this technology. It is highly durable and stable, and it can be integrated into a variety of systems with minimal to no downtime. Because of its better I/O density, smaller size, and multi-die capability on a single platform, embedded die is a desired alternative.
Some of the key players in Embedded Die Packaging Technology Market include Amkor Technology Inc., ASE Group, AT&S Group, Fujikura Ltd., Fujitsu Limited, Infenion Technologies AG, Intel Corporation, Microsemi Corporation, Schweizer Electronic AG, Shinko Electric Industries Co. Ltd, STMicroelectronics, Taiwan Semiconductor Manufacturing Company Limited, TDK Corporation, Texas Instruments Incorporation and Toshiba Corporation.
Products Covered:
• Embedded Die in IC Package Substrate
• Embedded Die in Rigid Board
• Embedded Die in Flexible Board
Applications Covered:
• Medical Wearable Devices
• Smartphone & Tablets
• Sports/Fitness Devices
• Industrial Controlling Devices
• Industrial Metering Devices
• Military
• Industrial Sensing
• Other Applications
End Users Covered:
• Consumer Electronics
• IT and Telecommunication
• Automotive
• Healthcare
• Aerospace & Defence
• Other End Users
Regions Covered:
• North America
o US
o Canada
o Mexico
• Europe
o Germany
o UK
o Italy
o France
o Spain
o Rest of Europe
• Asia Pacific
o Japan
o China
o India
o Australia
o New Zealand
o South Korea
o Rest of Asia Pacific
• South America
o Argentina
o Brazil
o Chile
o Rest of South America
• Middle East & Africa
o Saudi Arabia
o UAE
o Qatar
o South Africa
o Rest of Middle East & Africa
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