Global Electronic Packaging Market Report, Market Size, Share, Trends, Analysis and Forecast to 2028

Stratistics MRC’s Global Electronic Packaging Market value is expected to reach $6.49 billion growing at a CAGR of 20.51% during 2023-2030.

Electronic packaging is the design and manufacture of enclosures for electronic components, such as mainframe computers or individual semiconductors, up to entire systems. This guards against mechanical harm, cooling, the emission of radio frequency noise, and electrostatic discharge. When making consumer electronics like smartphones, TVs, tablets, set-top boxes, and digital media adapters, efficient electrical and semiconductor packaging is used to shield the components from dust, corrosion, water, and electrostatic discharge.

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Because of the demand from the electronics sector, technological advances, and substantial utilization areas in healthcare devices and packaging solutions, Asia-Pacific is predicted to have profitable growth. In the near future, market growth in the region is anticipated to be driven by an increase in the shrinking of electronic devices and goods across a wide range of electronic products. The National Investment Promotion and Facilitation Agency (NIPFA) reports that the demand for electronic products has significantly increased in India. Due to strong regulatory support, significant investments made by numerous stakeholders, and an increase in demand for electronic goods, it is predicted that the electronic manufacturing sector will reach US$220 billion by 2025.

Some of the key players in Electronic Packaging market include AMETEK Inc., Blue Spark Technology, Dordan Manufacturing Company, E. I. du Pont de Nemours and Company, Excellatron Solid State, GY Packaging, Plastiform Inc., Infinite Power Solutions, Kiva Container Corporation, Primex Design & Fabrication, Quality Foam Packaging Inc., Sealed Air Corporation, The Box Co-Op and UFP Technologies, Inc.

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Key Developments:

In June 2022, Digimarc Corporation announced a partnership with Sealed Air, a global leader in digital printing and packaging, to bring product digitization to markets such as eCommerce fulfillment, industrials, and consumer goods at scale via smart packaging.

In March 2022, Intel revealed the first phase of its efforts to invest up to EUR 80 billion (USD 84 billion) in the European Union over the following decade across the semiconductor value chain, from Research and Development to production to advanced packaging technologies.

What our report offers:
– Market share assessments for the regional and country-level segments

– Strategic recommendations for the new entrants

– Covers Market data for the years 2021, 2022, 2023, 2026, and 2030

– Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)

– Strategic recommendations in key business segments based on the market estimations

– Competitive landscaping mapping the key common trends

– Company profiling with detailed strategies, financials, and recent developments

– Supply chain trends mapping the latest technological advancements

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