Global Memory Packaging Market is accounted for $32.43 billion in 2020 and is expected to reach $57.84 billion by 2028 growing at a CAGR of 7.5% during the forecast period. Growth in packaging and assembly infrastructure, rising demand for smartphones and growing popularity of autonomous driving are driving the market growth.
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By geography, Asia Pacific is going to have high growth during the forecast period which can be attributed to a wide range of applications in several consumer electronics, especially in tablets and smartphones.
Some of the key players profiled in the Memory Packaging Market include Apple Inc., ASE Group, Cisco Systems Inc., Dell EMC, Fujitsu Semiconductor Limited, Hana Micron Inc., IBM Corporation, Intel Corporation, Micron Technology Inc., Nanya Technology Corporation, Qualcomm Technologies Inc., Samsung Electronics Co. Ltd, SK Hynix Inc., STMicroelectronics and Toshiba Electronic Devices & Storage Corporation.
Platforms Covered in Memory Packaging Market
• Wafer-Level Chip-Scale Packaging(WLCSP)
• Wire-Bond
• Flip-Chip
• Lead-Frame
• Through-Silicon Via (TSV)
Applications Covered:
• 3D Through-Silicon Via (TSV) Packaging
• Dynamic Random Access Memory (DRAM) Packaging
• Not AND (NAND) Flash Packaging
• Not OR (NOR) Flash Packaging
End Users Covered:
• Automotive
• Consumer Electronics
• Embedded Systems
• Information Technology (IT) & Telecom
• Medical Devices
• Military and Aerospace
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